Wafer-Level Test Interface Authority

20μm Precision.
Total Integrity.

Merging 30 years of HDD contact rigor with advanced probing architectures. We define the physical standards for zero-drift electrical contact.

30 Years
ENGINEERING DNA
20μm Pitch
FABRICATION MASTERY
R² = 1.0
VALIDATION STANDARD

Core Division 01

Cantilever Probing.

Specializing in high-pin count DDI, Logic, and Flash Memory nodes. Featuring 20μm staggered pitch resolution and proprietary WRe (750 Hv) metallurgy for extended lifecycle reliability.

  • ✔ 6,000+ PIN Capacity
  • ✔ Low Leakage Performance (pA level)
  • ✔ Rapid 48-hour Maintenance Cycle
Galaxy Tech cantilever probe card with WRe needles for high-pin count DDI and Logic node wafer testing.

Core Division 02

Vertical & MEMS Arrays.

Engineered for 5nm/3nm Advanced Nodes. Our vertical solutions feature zero-scrub vertical integrity to protect delicate Micro-Bumps and Cu-Pillars under high-frequency test cycles.

Max Voltage: <3500V
Probe Material: N7 Alloy / Pd Alloy
Advanced vertical MEMS probe card for 5nm and 3nm semiconductor nodes featuring N7 alloy contact technology.

Yield Recovery & Maintenance.

Every interface eventually deviates. Galaxy Tech provides sub-micron realignment and planarity tuning using Agilent-verified metrology to minimize your test floor downtime.

VIEW SERVICE SLA →

Precision probe card maintenance and realignment services using Agilent-verified metrology for zero-drift contact.

Interfacing the Future of Test Efficiency.

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