Exacting Substrate Engineering

High-Layer &
Precision Foundations.

Engineered for 30 years to meet zero-drift requirements. Integrating premium DuPont™ and Taiflex® substrates and High-TG (≥170°C) materials for extreme thermal stability.

0.05 mm
MIN TRACE / SPACE
Tg ≥ 170°C
THERMAL INTEGRITY
0201 Ready
SMT PLACEMENT CAPABILITY

Technical Mastery

DuPont™ Solutions for Preamp Boards.

Galaxy Tech exclusively utilizes DuPont™ and Taiflex® materials for signal-sensitive Preamp PCBA/FPCA. Backed by our 30-year HDD heritage, we ensure 0.05mm fine-pitch routing for pristine signal-to-noise ratios in mission-critical preamplifier circuits.

OPTIMIZED SMT: 0201 READY
Galaxy Tech’s advanced lamination mastery: An FPCA integrated with multiple material stiffeners (PI, FR4, Al) of varying heights for high-frequency signal stability.

Galaxy Tech High-TG (≥170°C) PCB engineering for burn-in ovens and probe cards, ensuring zero deformation and high planarity during high-temperature testing.

Extreme Environments

High-TG (≥170°C) Engineering.

Stability at scale. Our High-TG (≥170°C) substrates are specifically engineered for the aggressive thermal demands of Burn-in Ovens and Semiconductor Probe Cards. This ensures zero mechanical deformation and maintains extreme planarity during high-temperature test cycles.

PROBE CARD READY
BURN-IN OVEN GRADE

Technical Performance Index

Application Application
Material Standard
Preamp Boards (FPC/FPCA)
DuPont™ / Taiflex®
Probe Cards & Burn-in Boards
High-TG (≥ 170°C)
Min Trace Width / Space
0.05 mm (2 mil)
Max Board Layer Count
32 Layers

Execute Your Micro-Precision Vision.

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