The Mechanical DNA of Interconnects

From Slider To Silicon.

Precision Probe Cards, High-Density Interconnects and Traceable Calibration Solutions for Advanced Semiconductor Testing.

Established in 2003, Galaxy Tech integrates more than 30 years of collective team mastery in HDD-standard contact mechanics with next-generation semiconductor precision.

Detailed macro view of high-precision probe card fabrication by Galaxy Tech, showcasing 20um narrow-pitch probe arrays and structural reinforcement for logic and memory semiconductor testing.

Probe Card Solutions

Fine-pitch vertical and cantilever probe architectures engineered for high-throughput wafer testing.

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Precision Interconnects

High-density PCBA, flexible circuits, and multi-thickness Aluminum stiffeners for Preamp applications.

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Calibration & Yield

Agilent-based measurement, register-level parameter write-back, and 100% serialized traceability.

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Technical Capability Highlights

Min Pitch
20 μm
Pin Count
6,000+
Warpage
≤ 0.13%
SMT Min
0201

Quality Verification & Compliance

ISO 9001:2015

Certified Manufacturing Hub

Audited facility management at our Dongguan technical center. Scope: High-precision electronic assembly & test interface fabrication.

NIST-Traceable

Calibration Excellence

Measurement equipment is calibrated against recognized reference standards with documented traceability to national physical references.

Regional Hubs

Japan, China & SE Asia Support

Strategic liaison offices serving global Tier-1 semiconductor supply chains from Hong Kong, Japan and Dongguan.

Integrated Mastery

Engineering, Calibration & Assembly — All In House.

By maintaining full in-house control of the technical cycle—from multi-thickness stiffener lamination to software-based coefficient calculation—we ensure the precision required for high-pin-count semiconductor interfaces.

32-LAYER FABRICATION
TDR + X-RAY VERIFIED
EEPROM WRITE-BACK
Galaxy Tech senior engineer overseeing the re-engineering and thermal optimization of burn-in systems, demonstrating high-level engineering insight for semiconductor testing.

Discuss Your Probe Card or Precision Interconnect Project

Submit your specifications for a technical feasibility review within 24 business hours.

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