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Advanced Probe
Exacting
Active
Since 2003Corporate Foundation
20μm PitchFabrication Mastery
R² = 1.0Validation Standard
Primary Business
Advanced Probe
Card Fabrication.
Specializing in high-density Cantilever and Vertical architectures. Supporting 20μm staggered pitch and up to 6,000+ PIN counts with verified WRe and Pd Alloy metallurgy.
Manufacturing Integrity
Exacting
PCBA Execution.
A managed integrator for 32-layer Rigid-Flex and Flip-Chip assembly. Every batch is verified through 100% Automated X-Ray Metrology to ensure zero-defect signal paths.
Heller 10-Zone Reflow | IPC Class 3
Yield Engineering
Active
Write-Back.
We close the loop between hardware and silicon yield. Using Agilent-based system insights, we achieve a verified R² = 1.0 accuracy across all high-density channels.
Global Engineering Network.
Strategic HQ
Hong Kong
Strategic Logistics & IP Oversight.
Technical Liaison
Japan
Material Sourcing & JDM Liaison.
Manufacturing Unit
Dongguan
Agile High-Precision Workshop.