Since 2003Corporate Foundation
20μm PitchFabrication Mastery
R² = 1.0Validation Standard

Primary Business

Advanced Probe
Card Fabrication.

Specializing in high-density Cantilever and Vertical architectures. Supporting 20μm staggered pitch and up to 6,000+ PIN counts with verified WRe and Pd Alloy metallurgy.

EXPLORE PROBING ARCHITECTURES ➔

Manufacturing Integrity

Exacting
PCBA Execution.

A managed integrator for 32-layer Rigid-Flex and Flip-Chip assembly. Every batch is verified through 100% Automated X-Ray Metrology to ensure zero-defect signal paths.

Heller 10-Zone Reflow | IPC Class 3
Professional macro view of a Galaxy Tech high-density interconnect carrier board with hard gold surface finish. This engineering-grade PCBA demonstrates sub-micron trace precision and impedance-matched signal paths for advanced semiconductor testing and Flip-Chip assembly.

Yield Engineering

Active
Write-Back.

We close the loop between hardware and silicon yield. Using Agilent-based system insights, we achieve a verified R² = 1.0 accuracy across all high-density channels.

VIEW VALIDATION LOGS ➔

Galaxy Tech digital metrology log demonstrating perfect R²=1 linearity in Voltage-Measure-Sync calibration for high-density Flip-Chip interconnects. This verified mathematical model ensures zero signal drift and optimized yield for advanced semiconductor wafer testing interfaces."

Global Engineering Network.

Strategic HQ

Hong Kong

Strategic Logistics & IP Oversight.

Technical Liaison

Japan

Material Sourcing & JDM Liaison.

Manufacturing Unit

Dongguan

Agile High-Precision Workshop.