Whether you require a small number of rapid-turn prototypes or several thousand production boards, Galaxy provides comprehensive PCB assembly services tailored to your specific scale. Our services encompass SMT assembly, Flip Chip assembly, BGA assembly, through-hole assembly, mixed assembly, flex PCB assembly, and rigid-flex printed circuit board assembly.

• Proficient assembly of PCB components, including various BGAs, Flip chip, QFNs, CSPs, 0201, POP, and press-fit components, even in small quantities.
• Expertise in assembling BGA, micro-BGA, QFN, CSP, and any leadless devices with a pitch of up to 0.35mm, accompanied by 100% 3D X-ray inspection.
• Implementation of the Design for Assembly (DFA) process, effectively identifying almost all manufacturing issues before actual assembly, thereby preventing production holdups.
• Adherence to diverse chemistries such as RoHS, leaded, indium, clean, and no-clean.
• Utilization of paste in-hole techniques for enhanced assembly.
• Thorough cleaning of assembled boards, ensuring cleanliness and quality.

• ESD Coating
• Conformal Coating
• Function test
• Reliability Testing, incorporating temperature cycling.
• Wire Bonding services.
• ICT (In-Circuit Testing)