The Standard of Physical Integrity
Engineering
The Precision.
Derived from 30 years of high-sensitivity HDD test legacies. We apply sub-micron mechanical standards to solve the complex interconnect challenges of next-generation semiconductors.
30 Years
SUB-MICRON DISCIPLINE
±1.0°C
THERMAL STABILITY
Class 3
IPC EXECUTION STANDARD
Mechatronics Optimization
Thermal System Re-Engineering.
By analyzing real-world airflow and thermal expansion (CTE) variance, Galaxy Tech successfully optimized burn-in oven systems for Tier-1 clients. This expertise allows us to master the thermal dynamics required for high-stability probe card fabrication under extreme test cycles.
“If we can master the thermal dynamics of a system, we can guarantee the mechanical planarity of our hardware under the most intense stress.”
Agile Fabrication
Execution is the Ultimate Standard.
Our Dongguan Technical Workshop acts as a rapid-response unit for high-fidelity technical batches. We specialize in precision micro-assembly and structural reinforcement, ensuring every design is translated into hardware that meets 100% functional specifications.
Quality Gate
IPC-A-610 Class 3 / ISO 9001
IPC-A-610 Class 3 / ISO 9001
Verification
Sub-micron Alignment Checks
Sub-micron Alignment Checks
