Exacting Build-to-Print Fabrication

High-Layer
Rigid PCB.

Engineered for 30 years to meet the zero-drift requirements of the magnetic recording industry. We translate your complex interconnect designs into high-fidelity physical substrates.

32 LayersMax Layer Count
2.5 / 2.5 milMin Trace & Space
IPC-Class 3Aerospace Standard

Signal Integrity

High-Density
Interconnect (HDI).

Every Rigid PCB is a managed engineering project. We utilize high-Tg FR4 and ceramic filled materials to ensure absolute structural stability under the aggressive thermal cycles of wafer-level testing.

MaterialHigh-Tg FR4, Isola, Rogers
Surface FinishENEPIG, Hard Gold (50u”)


Galaxy Rigid PCB Fabrication

Technical Performance Index

Mechanical Specs

Max Board Size600 x 500 mm
Finished Thickness0.2 ~ 6.0 mm
Hole Wall CopperMin. 25μm (Class 3)

Precision Limits

Registration Accuracy± 0.05 mm
Aspect Ratio12 : 1
Impedance Control± 5% – 10%

Interfacing the Future
of Rigid Interconnects.

SUBMIT TECHNICAL RFQ