Complex Interconnect Architecture
The Synergy of
Rigid and Flex.
Engineered for high-RPM simulation and space-constrained probing. Our Rigid-Flex solutions integrate decades of storage-grade dynamic reliability into high-fidelity silicon test interfaces.
20+ LayersComplex Stackup
Laser ViaBlind & Buried Mastery
±10% RcImpedance Control
Mechanical Freedom
3D Structural
3D Structural
Reliability.
At Galaxy Tech, Rigid-Flex is more than a board—it’s a system. We utilize advanced bonding materials and laser-drilling to ensure zero-defect transitions between rigid support zones and dynamic flex regions.
Validated for High-Vibration Probe Station Environments.
Rigid-Flex Engineering Specification
Stackup Capability
Max Layer Count2 – 20+ Layers
Board Thickness0.4mm – 3.2mm
Core MaterialFR4 + Polyimide
Processing Limits
Min Trace/Space2.5 / 2.5 mil
Drilling MethodCO2 / UV Laser
Min Hole Size0.1 mm
Verification
Surface FinishHard Gold / ENEPIG
Testing100% X-Ray / Flying Probe
ComplianceIPC-6013 Class 3