Dynamic Interconnect Engineering

High-Performance
Flexible FPC.

Merging 30 years of HDD-standard dynamic flex rigor with sub-micron fabrication. We deliver multi-layer FPC solutions designed for extreme bending environments and high-frequency signal paths.

1 – 8 LayersFlex Fabrication
±10%Impedance Control
450mmMax Interface Length

Bespoke Solutions

Dynamic Bending
Optimization.

Every FPC is a study in material fatigue and signal integrity. Leveraging our legacy in HDD Slider Dynamic Testing (SDT), we engineer flexible interconnects that withstand millions of cycles without trace fracture or signal degradation.

Validated for High-RPM Simulation & Wafer-Sort Nodes.


Galaxy FPC Fabrication

FPC Engineering Specification

Precision Fabrication

Min Trace/Space2 / 2 mil
Layer Count1 – 8 Layers
Max Board Size450 x 250 mm

Material Science

Base MaterialPolyimide (PI), PET
Copper Thickness12μm – 70μm
Cover-layPI, Photo-imageable

Surface Finish

Gold PlatingENIG, Hard Gold (50u”)
Solder MaskFlexible Green, Black
StiffenerFR4, SUS, PI

Accelerate Your
Flexible Interconnect System.

SUBMIT TECHNICAL RFQ