Advanced Verification Engineering

The Geometry
of Yield.

Defining interconnect integrity through in-house Automated X-Ray Metrology (AXI). We ensure zero-defect reliability for high-density silicon test sites.

32 LayersFabrication Depth
±0.03mmPlacement Precision
100% NDTNon-Destructive Testing

Exacting Execution

Flip Chip
Integration.

Galaxy Tech executes complex Flip-Chip on Board (FCOB) and Flex (FCOF) blueprints with aerospace-grade discipline. We specialize in high-lead-count interconnects where bump coplanarity is critical.

SubstrateRigid, Flex, Ceramic
Min Ball Diameter0.05 mm
ComplianceIPC-A-610 Class 3

In-house 2D X-ray non-destructive inspection of Flip-Chip micro-bump arrays, demonstrating sub-micron alignment and interconnect integrity for high-density semiconductor test solutions and probe card fabrication.

Process Sovereignty

Thermal & Signal
Integrity.

Our managed manufacturing model utilizes 10-zone Heller reflow systems and nitrogen-controlled environments to ensure zero signal drift. Build-to-print execution is verified by 100% process traceability.

Automated Quality Gate

Real-time AOI & X-Ray Reporting per Batch.


Galaxy Tech performing real-time active calibration on PCBA assemblies using Agilent high-bandwidth oscilloscopes for signal integrity validation and parameter write-back.

Execute Your
Mission-Critical Interconnect.

SUBMIT TECHNICAL RFQ