Wafer-Level Test Interface Authority

20μm Precision.
Total Integrity.

Merging 30 years of HDD contact rigor with advanced probing architectures. We define the physical standards for zero-drift electrical contact.

30 YearsEngineering DNA
20μm PitchFabrication Mastery
R² = 1.0Validation Standard

Core Division 01

Cantilever
Probing.

Specializing in high-pin count DDI and Logic nodes. Featuring 20μm staggered pitch resolution and proprietary WRe (750 Hv) metallurgy for extended lifecycle reliability.

EXPLORE ARCHITECTURE ➔

Core Division 02

Vertical &
MEMS Arrays.

Engineered for 5nm/3nm Advanced Nodes. Our vertical solutions feature zero-scrub vertical integrity to protect delicate Micro-Bumps and Cu-Pillars under high-frequency test cycles.

EXPLORE ARCHITECTURE ➔

Lifecycle Support

Yield Recovery
& Maintenance.

Every interface eventually deviates. Galaxy provides sub-micron realignment and planarity tuning within 48 hours to minimize your test floor downtime.

VIEW SERVICE SLA ➔

Interfacing the Future
of Test Efficiency.

SUBMIT TECHNICAL RFQ