Advanced Interconnect Engineering

Turnkey PCBA &
FPCA Solutions.

Galaxy Tech delivers an integrated turnkey workflow: from Schematic Design & PCB Fabrication to Precision Flip-Chip SMT and specialized ESD/Conformal Coating.

01. DESIGN
In-house Layout
02. FAB
32-Layer Mastery
03. SMT
Flip Chip Ready
04. COAT
ESD & Conformal


Galaxy Tech high-precision PCBA featuring Flip Chip technology, demonstrating 30 years of engineering mastery in dynamic micro-contact and signal integrity.
Exacting Execution

32-Layer Fabrication Mastery.

A managed integrator for **High-Complexity Flip-Chip assembly**. Our production lines handle 01005 passives and fine-pitch BGA with 100% 3D X-Ray verification.

  • ✔ Aerospace-Grade TDR Trace Integrity Analysis
  • ✔ In-house Agilent-powered Functional Testing
  • ✔ Automated AOI and X-Ray reporting per batch


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Flexible Interconnects

Integrated FPCA Solutions.

Specializing in Flip-Chip on Flex (FCOF) with extreme Z-axis precision. We manage complex lamination of PI, FR4, and multi-thickness Aluminum stiffeners on a single board to optimize thermal dissipation and signal integrity.

SCLK / SDATA / SDEN DIAGNOSTICS READY

Galaxy Tech's in-house automated ESD coating and conformal coating process for high-precision semiconductor test carriers and FPCA.

IN-HOUSE AUTOMATED COATING LINE
Protective Engineering

ESD & Conformal Coating.

Protecting sensitive semiconductor carriers from environmental stress. Our professional automated coating facility in Dongguan ensures every high-value PCBA is shielded against moisture, dust, and electrostatic interference.

ESD Shielding

Anti-static layers for silicon-sort carriers.

Resin Coating

Humidity and chemical resistance sprays.

Secure Your Signal Integrity Today.

Submit Turnkey RFQ