Extreme Precision.
Dynamic Integrity.
Specializing in FPC & PCB Assembly with Flip-Chip integration. Driven by 30 years of HDD engineering mastery and 0.05mm micro-precision fabrication.
High-Complexity Rigid PCBA.
Galaxy Tech executes high-density Rigid PCBA with aerospace-grade surface finish combinations. We are one of the few providers capable of integrating OSP, Immersion Gold (ENIG), and Hard Gold on a single substrate to meet varied bonding and contact requirements.
- ✔ 0201 Component SMT & Flip-Chip Bonding
- ✔ Tri-Surface Finish Mastery (OSP + ENIG + Gold)
- ✔ 100% Traceability with Automated X-Ray & AOI
Bespoke Preamp FPCA solutions.
Our competitive edge lies in the Multi-thickness Structural Integration for Preamp boards. We manage simultaneous lamination of PI, FR4, and Aluminum stiffeners on one board to guarantee extreme Z-axis stability and warpage control within 0.13%.
0.05mm Trace Integrity | Variable Z-Height Reinforcements | DuPont™ & Taiflex® Base.
EEPROM Data Write-Back.
Galaxy Tech bridges the gap between hardware and silicon yield. We perform Active Calibration post-assembly, processing raw Agilent-verified feedback to write specific gain and offset parameters directly into the EEPROM / Flip-Chip registers.
Final Shipment Quality Audit
* 100% Traceability: TDR, X-Ray, Reflow Profiles, and Calibration Reports included.