Advanced Verification Engineering

The Geometry
of Yield.

Defining interconnect integrity through in-house Automated X-Ray Metrology (AXI). We deliver zero-defect reliability for high-density silicon test sites.

32 Layers
Fabrication Depth
±0.03mm
Placement Precision
100% NDT
Non-Destructive Testing

Exacting Execution

Flip Chip Integration.

Galaxy Tech executes complex Flip-Chip on Board (FCOB) and Flex (FCOF) blueprints with aerospace-grade discipline. We specialize in high-lead-count interconnects where bump coplanarity is critical.

  • • Substrate: Rigid, Flex, Ceramic, Rigid-Flex
  • • Min Ball Diameter: 0.05 mm
  • • Compliance: IPC-A-610 Class 3
In-house 2D X-ray non-destructive inspection of Flip-Chip micro-bump arrays, demonstrating sub-micron alignment and interconnect integrity for high-density semiconductor test solutions and probe card fabrication.

Process Sovereignty

Thermal & Signal Integrity.

Our managed manufacturing model utilizes 10-zone Heller reflow systems and nitrogen-controlled environments to ensure zero signal drift. Build-to-print execution is verified by 100% process traceability.

Automated Quality Gate:
Real-time AOI & X-Ray Reporting per Batch.
Galaxy Tech performing real-time active calibration on PCBA assemblies using Agilent high-bandwidth oscilloscopes for signal integrity validation and parameter write-back.

Global Engineering Network

Hong Kong

Strategic HQ & RFQ Center

Japan

Material Sourcing & JDM Liaison

Dongguan

Agile Manufacturing Unit

Execute Your Mission-Critical Interconnect.

Submit Technical RFQ