Wafer-Level Test Interface Authority

20μm Precision.
Total Integrity.

Merging 30 years of HDD contact rigor with advanced probing architectures. We define the physical standards for zero-drift electrical contact in high-density wafer testing.

20μm Pitch
MIN STAGGERED RESOLUTION
6,000+ PINS
MULTI-SITE CAPACITY
WRe / N7
ADVANCED METALLURGY

Display Driver Domain

Exacting LCD/OLED Test Interfaces.

Derived from three decades of mastering micro-contact for HDD preamps. Our cantilever solutions are specifically tuned for high-RPM simulation environments and ultra-fine pad sorting, achieving < 1pA @ 10V leakage performance.

FREQUENCY: UP TO 2.5 Gbps
ALIGNMENT: ± 3.0μm

Galaxy Tech cantilever probe card with WRe needles for high-pin count DDI and Logic node wafer testing.

Process Sovereignty

Automated Probe Geometry Verification.

Execution is verified by physics. Utilizing high-resolution Automated Optical Metrology, we conduct 100% batch validation of probe tip position, alignment, and planarity. Our verification logs ensure that every manufactured interface perfectly matches your design parameters.

  • ✔ 100% Automated Tip Position Analysis
  • ✔ Planarity Tuning for Multi-Site Consistency
  • ✔ Full Dimensional Traceability Reports

Galaxy Tech lead engineer using an automated optical metrology system for high-precision probe card geometry and planarity verification.

Interfacing the Future of Test Efficiency.

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