Advanced Dynamic Interconnects

Flexible FPC &
Rigid-Flex Solutions.

Merging 30 years of HDD dynamic flex rigor with advanced 3D structural reliability. We deliver high-density flexible solutions designed for extreme bending and semiconductor test environments.

20+ Layers
COMPLEX RIGID-FLEX
0.05 mm
MIN TRACE / SPACE
±0.02mm
Z-AXIS PRECISION

Structural mastery

Advanced Preamp Stiffener Technology.

Galaxy Tech excels in Multi-thickness Aluminum Stiffener integration on a single FPCA. Utilizing DuPont™ and Taiflex® materials, we achieve ≤ 0.13% warpage control, ensuring mirror-grade planarity for high-pin count Flip Chip bonding.

Materials: DuPont™ Pyralux®, Taiflex® | Finish: OSP + Hard Gold (50u”)

Surface Protection

Expert ESD & Conformal Coating.

We safeguard flexible circuits from environmental and electrostatic stress. Galaxy Tech provides automated ESD Coating specialized for Slider test boards to eliminate discharge risks, and high-reliability Conformal Coating for industrial carriers.

ESD Shielding (Slider Boards)
Conformal Spray (Industrial)

Galaxy Tech's in-house automated ESD coating and conformal coating process for high-precision semiconductor test carriers and FPCA.

Mechanical Freedom

3D Structural Reliability.

Our Rigid-Flex solutions integrate decades of storage-grade dynamic reliability into silicon test interfaces. Using advanced bonding materials and UV Laser Drilling, we ensure zero-defect transitions between rigid support zones and dynamic flex regions.

Core Specs: 20+ Layers | Laser Blind/Buried Vias | IPC-6013 Class 3

Galaxy Tech high-precision Rigid-Flex PCB assembly featuring multi-layer integration and fine-pitch flexible circuitry for semiconductor testing.

Solve Your 3D Interconnect Challenge.

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